Title:
CONDUCTIVE PASTE COMPOSITE AND CIRCUIT SUBSTRATE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH01128305
Kind Code:
A
Abstract:
PURPOSE:To manufacture a circuit substrate having excellent performance by using a conductive paste composite containing the first metal group selected from silver and gold and thereto the second metal group containing a group of Ti, Zr at a specific rate as well as an organic vehicle. CONSTITUTION:A conductive paste composite is formed by containing powder of the first metal selected from a group consisting of silver, gold, platinum, and Pa, and powder of the second metal consisting of a metal selected from a group of Ti, Zr, Cr and their hybrides or an alloy of its metal and the first metal (weight of the second metal shall be 0.001-0.1% of the total weight of the first and second metals), an organic vehicle and glass material powder. Then, this conductive paste composite is applied on a non-oxide system ceramic substrate 1 by a screen printing method while being heated and first in the atmosphere to form a circuit substrate 10 having a conductive layer 2. Thereby, the circuit substrate 10 having the good wetting and anticorrosion property against metal solder, further being excellent in safety can be manufactured.
Inventors:
KURIHARA YASUTOSHI
TAKAHASHI SHIGERU
YATSUNO KOMEI
ENDO TSUNEO
AKEYAMA KENJI
TAKAHASHI SHIGERU
YATSUNO KOMEI
ENDO TSUNEO
AKEYAMA KENJI
Application Number:
JP28305787A
Publication Date:
May 22, 1989
Filing Date:
November 11, 1987
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01B1/22; H01B1/16; H01B13/00; H05K1/09; (IPC1-7): H01B1/22; H05K1/09
Domestic Patent References:
| JPS58178903A | 1983-10-20 |
Attorney, Agent or Firm:
Hiroshi Nakamoto (1 outside)