PURPOSE: To improve an appearance and a characteristic of a porcelain substrate by using a conductive paste composite, wherein parasium-coated silver powder and silver powder having a specific average grain size are contained, the rest shall be an organic vehicle and glass powder and the parasium contents shall be 0.3 to 1.5wt.%.

CONSTITUTION: The subject conductive paste composite consists of 2 to 15wt.% of parasium-coated silver powder having an average grain size 0.1 to 0.5μm, 62 to 75wt.% of silver powder having an average grain size 0.7 to 1.2μm and the rest consisting of an organic vehicle and glass powder, while the total amount of parasium in paste shall be 0.3 to 1.5wt.%. A metallized layer formed by using parasium-coated silver powder and silver powder like these consists of an extremely dense upper layer containing plenty of parasium-coated silver powder and the porous lower layer containing plenty of silver powder while the upper layer improves adhesiveness of semiconductor chips and the lower layer improves mechanical strength interposing glass to a substrate further easing up stress to the semiconductor chips. Further, in the upper layer, silver powders are coated with parasium so that parasium fine powders are not isolated thus to dissolve a problem of appearance.