Title:
CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH
Document Type and Number:
Japanese Patent JP2020115473
Kind Code:
A
Abstract:
To permit formation of narrow, high aspect ratio features in a conductive structure.SOLUTION: A paste composition comprises: (a) a source of electrically conductive metal; (b) a glass frit of 0.25-8 wt.% based on the total weight of the conductive paste; and (c) an organic vehicle in which the source of electrically conductive metal and the glass frit are dispersed, the organic vehicle comprising organic polymer material and a solvent, where the organic polymer material comprises microgel particles having polymer units with molecular weights ranging from 107 to 1012 and optionally one or more additional polymeric materials, with the total amount of the organic polymer material ranging from 0.01 to 5 wt.% based on the total weight of the paste composition.SELECTED DRAWING: Figure 1F
Inventors:
MICHAEL STEPHEN WOLFE
SUMMERS JOHN DONALD
BRYAN BENEDICT SAUER
HOANG VI TRAN
BRIAN D MATHER
LEE HEE HYUN
ESTHER KIM
MA HELEN CATIVO
TAO YUEFEI
SUMMERS JOHN DONALD
BRYAN BENEDICT SAUER
HOANG VI TRAN
BRIAN D MATHER
LEE HEE HYUN
ESTHER KIM
MA HELEN CATIVO
TAO YUEFEI
Application Number:
JP2020073995A
Publication Date:
July 30, 2020
Filing Date:
April 17, 2020
Export Citation:
Assignee:
DU PONT
International Classes:
H01B1/22
Domestic Patent References:
| JP2003323816A | 2003-11-14 |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office