Title:
Conductive paste and a connection structure
Document Type and Number:
Japanese Patent JP6082843
Kind Code:
B2
Abstract:
Provided is an electroconductive paste with which it is possible to dispose solder particles on electrodes in an efficient manner, prevent positional displacement between the electrodes, and increase the reliability of conduction between the electrodes. This electroconductive paste contains a plurality of solder particles and a binder. The solder particles are particles in which both a center portion and the outer surface of an electroconductive part are made of solder. A group having at least one carboxyl group is convalently bonded to the surface of the solder of the solder particles interposed therebetween by a group represented by the following formula (X), an ether bond, or an ester bond. The minimum value of the viscosity of the electroconductive paste in a temperature range extending from 10°C below the melting point of the solder to the melting point of solder is 100 mPa·s or higher and the maximum value of the viscosity of the electroconductive paste in a temperature range extending from 10°C below the melting point of the solder to the melting point of the solder is 2000 mPa·s or lower.
Inventors:
Ryohei Masui
Hideaki Ishizawa
Shinya Uenoyama
Hideaki Ishizawa
Shinya Uenoyama
Application Number:
JP2016510340A
Publication Date:
February 15, 2017
Filing Date:
February 17, 2016
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01B1/22; H01B1/00; H01L21/60; H05K3/34
Domestic Patent References:
| JP2006236759A | 2006-09-07 | |||
| JP2014529689A | 2014-11-13 |
Foreign References:
| WO2013125517A1 | 2013-08-29 | |||
| WO2010027017A1 | 2010-03-11 | |||
| WO2014112541A1 | 2014-07-24 | |||
| WO2008047600A1 | 2008-04-24 |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office