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Title:
CONDUCTIVE PASTE, AND FORMATION METHOD OF COPPER FILM USING THE SAME
Document Type and Number:
Japanese Patent JP2009158441
Kind Code:
A
Abstract:

To provide a conductive paste capable of easily forming a dense copper film in a desired shape at low temperature.

This conductive paste contains: (A) copper formate (II) or its compound; (B) an amino compound represented by formula NR1R2R3, wherein R1 is a 2-4C straight-chain or branched-chain alkyl group substituted with one substituent selected from a group consisting of a hydroxyl group, a methoxy group, an ethoxy group and an amino group, and R2 and R3 are each independently hydrogen or a 1-3C alkyl group that may be substituted with a hydroxyl group or an amino group; and (C) a 5-11C saturated fatty acid; and is characterized in that the constituent (C) is 0.1-1 mol to 1 mol of the constituent (A).


Inventors:
MARUYAMA HIROKI
YOSHII AKITO
Application Number:
JP2007338884A
Publication Date:
July 16, 2009
Filing Date:
December 28, 2007
Export Citation:
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Assignee:
NAMICS CORP
International Classes:
H01B13/00
Domestic Patent References:
JPH1072673A1998-03-17
JP2005002471A2005-01-06
JP2002329419A2002-11-15
JP2004059987A2004-02-26
JP2007035353A2007-02-08
Attorney, Agent or Firm:
Hajime Tsukuni
Koshiro Tsukuda
Fusayuki Saito