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Title:
CONDUCTIVE PASTE FOR HIGH TEMPERATURE SINTERING, CONDUCTIVE ADHESION FILM, AND FIELD EMISSION DISPLAY
Document Type and Number:
Japanese Patent JP2005302607
Kind Code:
A
Abstract:

To provide such a conductive paste for high temperature sintering and a conductive adhesion film that form a conductive film having a prescribed resistance and adhering property by sintering and not reacting with a phosphor layer, and to provide a field emission display device, to which the conductive adhesion film is applied.

The conductive paste for high temperature sintering contains a glass frit, a solvent, and a shape anisotropic conductive oxide powder, and a cubic volume ratio of the conductive oxide powder : the glass frit is set within a range of 5:95 to 35:65. The conductive film, composed of the conductive oxide powder and the glass frit, formed by sintering in high temperature, has adhering property.


Inventors:
Yukinobu, Masaya
Application Number:
JP2004000119395
Publication Date:
October 27, 2005
Filing Date:
April 14, 2004
Export Citation:
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Assignee:
SUMITOMO METAL MINING CO LTD
International Classes:
H01J31/12; H01B1/00; H01B1/14; H01B1/20; H01J29/87; H01J31/12; H01B1/00; H01B1/14; H01B1/20; H01J29/87; (IPC1-7): H01B1/20; H01B1/00; H01B1/14; H01J31/12