To provide conductive paste for baked conductive film formation capable of forming a conductor line (fine line) having thick film thickness (for example 25 μm or more) and high shape-accuracy, even by one printing.

This conductive paste contains silver powder of 80 mass% or more per 100 mass% corresponding to the whole of the paste, wherein the particle size of the silver powder is 1.2-1.5 μm, carbon black of 0.1-1. 0 pts. mass per the silver powder of 100 pts.mass, resin component (mixture of ethyl cellulose and maleic resin mixed in the mass ratio of 87.5:12.5) of the remaining portion, plasticizer (dioctyl phthalate) , and an organic solvent (butyl carbitol acetate), and has a viscosity of 500 Pa s or more which is measured by a rotational viscometer. The average particle size of the carbon black is preferably 20-50 nm.