Title:
接合用の導電性ペースト
Document Type and Number:
Japanese Patent JP6849374
Kind Code:
B2
Abstract:
The present invention relates to a conductive paste for bonding that comprises a metal powder and a solvent, wherein the metal powder comprises a first metal powder having a particle diameter (D50) of 10 to 150 nm and a second metal powder having a particle diameter (D50) of 151 to 500 nm. The paste is useful for manufacturing an electronic device comprising a substrate with an electrically conductive layer and an electrical or electronic component, which are reliably bonded together using the paste.
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Inventors:
Takuya Konno
Application Number:
JP2016198342A
Publication Date:
March 24, 2021
Filing Date:
October 06, 2016
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
H01L21/52; B22F1/00; B22F7/04; C23C24/08; H01B1/22
Domestic Patent References:
| JP2007035353A | ||||
| JP2014035974A | ||||
| JP2014167145A | ||||
| JP2016069710A | ||||
| JP2012182111A |
Foreign References:
| WO2009098938A1 | ||||
| WO2013108408A1 | ||||
| US10308856 |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office