Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONDUCTIVE PASTE AND LAMINATED CERAMIC ELECTRONIC PART
Document Type and Number:
Japanese Patent JPH08255509
Kind Code:
A
Abstract:

PURPOSE: To reduce the occurrence of delamination in using Ag/Pb paste, by containing at least one kind of a metal of Ti, V, Cr, Zr, Nb, and Mo, etc. of less 1wt.% in metallic powder.

CONSTITUTION: In metallic powder having a main component of silver and palladium, at least one kind of a metal of a Ti, V, Cr, Zr, Nb, Mo, Ta, W, Si, and Ge of less 1wt.% is added. This can sinter and contract silver/palladium on a higher temperature side to restrain the occurrence of delamination. Consequently, the sintering and contracting of an inside electrode can be delayed on a high temperature side to reduce the differential thermal expansion between dielectric and electrode layers by using such metallic powder as the metallic powder of conductive paste having the main body of metallic powder having the main components of silver and palladium. A laminated ceramic capacitor, using the conductive paste as an inside electrode, can reduce the occurrence of a crack or delamination.


More Like This:
Inventors:
SATO YUICHI
HARADA KOICHI
OKUWADA HISAMI
KANAI HIDEYUKI
YAMASHITA YOHACHI
Application Number:
JP5688395A
Publication Date:
October 01, 1996
Filing Date:
March 16, 1995
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOSHIBA CORP
International Classes:
H01G4/12; H01B1/16; (IPC1-7): H01B1/16; H01G4/12
Attorney, Agent or Firm:
Noriyuki Noriyuki