CONDUCTIVE PASTE AND PRINTED WIRING BOARD USING THE SAME, AND CONDUCTIVE FILLER SEPARATING AND COLLECTING METHOD

Title:

CONDUCTIVE PASTE AND PRINTED WIRING BOARD USING THE SAME, AND CONDUCTIVE FILLER SEPARATING AND COLLECTING METHOD

Document Type and Number:

Japanese Patent JP2003151348

Kind Code:

A

Abstract:

To provide a conductive paste of an environment-friendly type.

The conductive paste comprises a conductive filler component and a binder component, the binder component containing, dominantly, a biomass.

Inventors:

TAKEZAWA HIROTERU
ISHIMARU YUKIHIRO
KITAE TAKASHI
NISHIYAMA TOSAKU
SOGO HIROSHI

Application Number:

JP2001348408A

Publication Date:

May 23, 2003

Filing Date:

November 14, 2001

Export Citation:

Assignee:

MATSUSHITA ELECTRIC IND CO LTD

International Classes:

H05K1/09; H01B1/20; H05K1/11; H05K1/18; (IPC1-7): H01B1/20; H05K1/09; H05K1/11

Attorney, Agent or Firm:

Fumio Iwahashi (2 others)

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