Title:
CONDUCTIVE PASTE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD USING THE SAME, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP3812221
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce electric resistance of interlayer connection or pattern wiring connection by using a conductive paste which comprises a residual binder resin as well as a conductive filler of a vol.% in a specified range and a hollow filler of a vol.% in a specified range.
SOLUTION: A conductive paste 1 comprises a conductive filer 2 of 10-50 vol.%, a hollow filler 3 of 0.1-5 vol.%, and a residual binder resin 4. When the conductive paste 1 is packed in a through hole 50 for curing or drying, it shrinks. Since the conductive paste 1 comprises the hollow filler 3, the entire shape of it changes, relatively and freely when shrunk. So, the conductive paste 1 sufficiently shrinks under curing thermal shrinkage, etc., and the comprised conductive fillers 2 are close to each other to reduce the resistance. Thus, a printed board 5 of low electric resistance in interlayer connection with excellent conductivity is provided.
Inventors:
Aichi Gosho
Yazaki Yoshitaro
Ryohei Kataoka
Yazaki Yoshitaro
Ryohei Kataoka
Application Number:
JP16108399A
Publication Date:
August 23, 2006
Filing Date:
June 08, 1999
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H05K1/09; H05K1/11; C09D5/24; C09D201/00; H01B1/20; H01L23/12; (IPC1-7): H05K1/09; C09D5/24; C09D201/00; H01B1/20; H01L23/12; H05K1/11
Domestic Patent References:
| JP10256687A | ||||
| JP6338214A | ||||
| JP9198916A | ||||
| JP5325647A | ||||
| JP11026654A | ||||
| JP4268340A | ||||
| JP10116640A | ||||
| JP8124421A |
Attorney, Agent or Firm:
Hirohiko Usui
Takashi Ito
Takashi Ito
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