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Patent Searching and Data


Title:
CONDUCTIVE PASTE AND PRODUCTION METHOD OF CONDUCTING FUNCTIONING MEMBER USING THE SAME
Document Type and Number:
Japanese Patent JP2010055807
Kind Code:
A
Abstract:

To provide a conductive paste, allowing preferable printing from an early stage of printing and capable of prolonging the service lifetime of a silicone blanket, and a production method of a conduction functioning member which uses the paste.

The conductive paste uses, as a solvent, a combined solvent of: a high-swelling solvent, such that the mass change V when a sample of a 2 cm2 cm silicone blanket after dipping the sample in the solvent at 231C for five hours is 40 mass% or higher; and a low-swelling solvent, such that the mass change V when a sample of a 2 cm2 cm silicone blanket after dipping the sample in the solvent at 231C for five hours is lower than 40 mass%. The product of the mass change rate V of the high-swelling solvent and the rate R (mass%) of the high-swelling solvent in the combined solvent is required to be 0.5 or higher, but 0.70 or lower. The production method includes forming a conductive pattern on a surface of a substrate by an intaglio offset printing method which uses the conductive paste.


Inventors:
Maki, Takashi
Application Number:
JP2008000216977
Publication Date:
March 11, 2010
Filing Date:
August 26, 2008
Export Citation:
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Assignee:
SUMITOMO RUBBER IND LTD
International Classes:
H01B1/22; B41M1/10; H01B1/20; H01B13/00; H01J9/02; H01J11/02; H01B1/22; B41M1/10; H01B1/20; H01B13/00; H01J9/02; H01J11/02