Title:
CONDUCTIVE PASTE RESIN COMPOSITION AND METHOD FOR PRODUCING ITS SINTERED BODY
Document Type and Number:
Japanese Patent JP3785480
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive paste resin composition (conductive resin paste) for a sinter mold in which the sintered molded product is a conductive sintered molded product and a paste resin composition containing the conductive inorganic powder and an organic binder is excellent in application, formability and sintering property, and to provide a method for producing a conductive sintered body.
SOLUTION: In the paste resin composition of the powder for the formation of a conductive sintered body, the conductive paste resin composition excellent in application, formability and sintering property contains (A) a (meth)acryl polymer having the weight average molecular weight, Mw, of 500 to 10,000 and the glass transition temperature (Tg) of -80 to 50°C and (B) a polymerizable polyfunctional monomer having the molecular weight of 100 to 5,000 and 2 to 6 polymerizable unsaturated groups and (C) the powder having the average particle diameter of 0.1 to 20 μm.
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Inventors:
Shuji Okamoto
Hiroshi Ueno
Hiroshi Ueno
Application Number:
JP2000291344A
Publication Date:
June 14, 2006
Filing Date:
September 26, 2000
Export Citation:
Assignee:
Soken Chemical Co., Ltd.
International Classes:
C04B41/88; C08F2/44; C08F2/48; C08F265/04; (IPC1-7): C08F2/44; C04B41/88; C08F2/48; C08F265/04
Domestic Patent References:
| JP2000199956A |
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