Title:
CONDUCTIVE PASTE WHICH CAN BE SOLDERED
Document Type and Number:
Japanese Patent JP2514516
Kind Code:
B2
Abstract:
PURPOSE: To obtain the copper paste having favorable soldering characteristics for using a low-activity halogen flux without entailing the degradation in various characteristics, such as electrical conductivity.
CONSTITUTION: This conductive paste consists of 0.5 to 8 pts.wt. dispersant, such as satd. fatty acid, 1 to 50 pts.wt. metal chelate forming agent and 0.1 to 1.5 pts.wt. tocopherol per 100 pts.wt. in total of both of 85 to 95wt.% metallic copper powder and 15 to 5wt.% resol type phenolic resin. The metallic copper powder having a dendrite shape, 2 to 30μm average particle size, 1.5 to 3.5g/cc bulk density and ≥15000 ratio of the specific surface area and loss of weight of hydrogen by reduction is used. The tocopherol improves solderability by preventing the oxidation of the copper powder and suppressing the copper spending at the time of soldering. The good solderability is, therefore, obtd. even if the low-activity halogen flux is used.
Inventors:
SUGIMOTO KENICHIRO
SUGYAMA KAZUNORI
WAKITA SHINICHI
SUGYAMA KAZUNORI
WAKITA SHINICHI
Application Number:
JP1990692A
Publication Date:
July 10, 1996
Filing Date:
February 05, 1992
Export Citation:
Assignee:
TATSUTA DENSEN KK
International Classes:
B23K35/22; C08K3/00; C08K5/09; C08K5/13; C08K5/17; C08L61/04; C08L61/10; C09D5/24; H01B1/22; H05K1/09; H05K3/34; (IPC1-7): B23K35/22; C09D5/24; H01B1/22; H05K1/09
Domestic Patent References:
| JP6434597A | ||||
| JP248185B2 | ||||
| JP248186B2 | ||||
| JP248187B2 |
Attorney, Agent or Firm:
Bunji Kamata (2 outside)