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Title:
CONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JP2005286014
Kind Code:
A
Abstract:

To provide a conductive paste which enables the manufacture of a lamination type piezoelectric element wherein little pore is in an inside electrode layer and structural defect such as delamination and cracks is hardly generated.

After the conductive paste consisting of a conductive powder, a piezoelectric powder and an organic vehicle is applied to a green sheet formed of a piezoelectric material and a lamination body is manufactured by laminating the green sheet, the lamination body is baked and a lamination type piezoelectric element 1 which is formed by laminating a piezoelectric layer 11 and the inside electrode layer 21 (22) is manufactured. The piezoelectric powder has almost the same element as the piezoelectric material of the green sheet, and is heated at a temperature of 40 to 80% of the baking temperature of the lamination body.


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Inventors:
MURAI ATSUSHI
KAMIMURA RIKIYA
KIHARA NORIAKI
Application Number:
JP2004096283A
Publication Date:
October 13, 2005
Filing Date:
March 29, 2004
Export Citation:
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Assignee:
DENSO CORP
NIPPON SOKEN
International Classes:
H01L41/083; H01B1/16; H01B1/22; H01L41/047; H01L41/16; H01L41/187; H01L41/22; H01L41/273; H01L41/297; H01L41/39; (IPC1-7): H01L41/083; H01B1/22; H01L41/187; H01L41/22; H01L41/24
Domestic Patent References:
JPH0684409A1994-03-25
JPH11273995A1999-10-08
JPS63120482A1988-05-24
JPH11354374A1999-12-24
JP2002245874A2002-08-30
Attorney, Agent or Firm:
Yoshiyasu Takahashi
Tamiwa Iwakura



 
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