To provide conductive paste composition to be used for internal electrode forming used for laminated ceramic electronic components which does not generate sheet attack and with little viscosity change after time.

The conductive paste contains conductive metal powder, ceramic powder, organic vehicle, dispersant, and organic solvent etc., and resin constituting the organic vehicle is a hydrophobic ethyl hydroxyethyl cellulose derivative, with an organic solvent to be at least one or more kinds chosen from dihydroterpinyl acetate, isobornyl acetate, isobornyl propionate, isobornyl butyrate, and isobornyl isobutyrate. An ethoxyl group content in the hydrophobic ethyl hydroxyethyl cellulose derivative is in a range of 56-63%.

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