To provide a new structure for a high conductive surface pattern and trace, a complex circuit and an antenna.
An improved emerging method and a material are used for forming the conductive pattern, the antenna, and the complex circuit, aiming at utilizing resin which can be electroplated directly for forming these products. The peculiar applicability of the resin which can be electroplated directly for making easy a manufacturing of a desired conductive pattern which uses a wide range processing and a manufacturing approach is disclosed. It is an intermediate product in manufacturing of the antenna. The intermediate product includes a constructional pattern. The constructional pattern specifies at least one portion of antenna to be perfected after. At least one portion of the constructional pattern contains the intermediate product which contains a conductive polymer.
COPYRIGHT: (C)2008,JPO&INPIT
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Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Nobuo Ogawa
Takaki Nishijima
Atsushi Hakoda