Title:
CONDUCTIVE PATTERN FORMATION METHOD AND CONDUCTIVE PATTERN FORMING WRITING INSTRUMENT
Document Type and Number:
Japanese Patent JP2015185212
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive pattern formation method which can conveniently prepare a conductive pattern and a conductive pattern forming writing instrument used for the method.SOLUTION: A conductive pattern formation method is characterized by giving, to a porous base material comprising a compound having halogen in a molecule by an ion bond, a conductive aqueous ink in an amount not exceeding an absorption capacity of the porous base material. There is also provided a conductive pattern forming writing instrument used for the method.
Inventors:
SHINO SHIGEKI
AKAIWA SHOJI
AKAIWA SHOJI
Application Number:
JP2014057651A
Publication Date:
October 22, 2015
Filing Date:
March 20, 2014
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
H01B13/00; B05D5/12; B05D7/24; B43K5/00; B43K7/00; B43K8/02; H05K3/10