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Title:
CONDUCTIVE PATTERN AND ITS FORMING METHOD
Document Type and Number:
Japanese Patent JP2011150928
Kind Code:
A
Abstract:

To provide a conductive pattern forming method capable of simply forming a conductive circuit pattern, the conductive circuit pattern, and a method for controlling an amount of doping of a conductive material to a conductive polymer film.

A manufacturing method for a conductive polymer film with the conductive pattern includes a process of reducing doped characteristics on an irradiated section of the conductive polymer film by pattern-irradiating an electromagnetic wave or a charged particle beam on the conductive polymer film, and a process of doping the conductive material to at least a non-irradiated section of the conductive polymer film by making the conductive polymer film with a section for reducing the doped characteristics expose to a conductive material containing atmosphere. The conductive polymer film with the conductive pattern is manufactured by this manufacturing method for a conductive polymer film. The method for controlling an amount of doping of the conductive material to the conductive polymer film utilizes irradiation of the electromagnetic wave or the charged particle beam.


Inventors:
KOIZUMI HITOSHI
Application Number:
JP2010012085A
Publication Date:
August 04, 2011
Filing Date:
January 22, 2010
Export Citation:
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Assignee:
UNIV HOKKAIDO
International Classes:
H01B13/00; H01B5/14
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes



 
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