Title:
導電性パターン作製方法
Document Type and Number:
Japanese Patent JP5485729
Kind Code:
B2
Abstract:
To provide manufacturing method of a composition containing silver ultrafine particles and a conductive pattern which do not need sintering process and dipping treatment.
The composition containing silver ultrafine particles contains the silver ultrafine particles with an average particle diameter of 0.1 μm and under, polymeric latex, and water-soluble halide in an aqueous medium. And the manufacturing method of the conductive pattern includes pattern making by applying and drying the composition containing silver ultrafine particles on surfaces of base materials and by ultraviolet ray irradiation and/or re-feeding of moisture to the pattern.
COPYRIGHT: (C)2011,JPO&INPIT
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Inventors:
Naoya Nishimura
Shigeki Shino
Shigeki Shino
Application Number:
JP2010017718A
Publication Date:
May 07, 2014
Filing Date:
January 29, 2010
Export Citation:
Assignee:
Mitsubishi Paper Mills Co., Ltd.
International Classes:
H01B13/00; B22F1/00; B22F9/00; B22F9/24; H01B1/00; H01B1/22; H01B5/14; H01L21/28; H01L21/288; H01L21/3205; H01L21/768; H01L23/522; H05K3/12
Domestic Patent References:
| JP2008004375A | ||||
| JP2009147121A |