PURPOSE: To obtain sufficient electrical conductivity even in a structure having a complicate shape by peeling and forming a base film from a plastic structure manufactured by monolithic-molding a dry film-formation conductive film disposed onto the surface of the base film directly or through a mold release layer.

CONSTITUTION: A conductive film 2 is arranged to a base film 4 by dry film formation through a mold release layer 5. When an adhesive layer 3 consisting of a cured resin is shaped and the whole is introduced into a mold 6 and molded by using molten plastics fed from a feed passage 7, the conductive film 2 is fast stuck to a molded plastic structure 1 at the same time as molding. When the base film 4 is peeled after the completion of molding, the conductive film 2 is attached firmly to the surface of the plastic structure 1. Accordingly, a conductive plastic structure having high quality is acquired with excellent productivity.