Title:
電気化学機械的研磨用の導電性研磨機器
Document Type and Number:
Japanese Patent JP2006527483
Kind Code:
A
Abstract:
Embodiments of a polishing article for processing a substracte are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer may be woven or non-woven. The conductive layer may be comprised of a soft material and, in one embodiment, the exposed surface may be planar.
Inventors:
Fu, Yonki
Allan, Daboust
Maines, Antoine, Pea.
Rhino, Stan, Dee.
Butterfield, Paul, Dee.
Won, Yang
Liu, Feng, Cue.
Neo, Shoe, S.
Chen, Liang-You
Chang, Yuan, A.
Kor, Sen-Hou
Ewald, Robert, A.
Allan, Daboust
Maines, Antoine, Pea.
Rhino, Stan, Dee.
Butterfield, Paul, Dee.
Won, Yang
Liu, Feng, Cue.
Neo, Shoe, S.
Chen, Liang-You
Chang, Yuan, A.
Kor, Sen-Hou
Ewald, Robert, A.
Application Number:
JP2006515213A
Publication Date:
November 30, 2006
Filing Date:
June 07, 2004
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/304; B23H5/08; B24B37/20; B24B37/22; C25F7/00
Domestic Patent References:
| JPH10270412A | 1998-10-09 | |||
| JP2001519250A | 2001-10-23 | |||
| JPS4823598B1 | 1973-07-14 |
Foreign References:
| WO2002085570A2 | 2002-10-31 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yuichi Yamada
Yuichi Yamada