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Title:
CONDUCTIVE POLYMER COATING COMPOSITION, METHOD FOR PRODUCING COATING FILM WITH THE SAME AND THE COATING FILM
Document Type and Number:
Japanese Patent JP2008050609
Kind Code:
A
Abstract:

To provide a conductive polymer coating composition, to provide a method for producing a coating film with the same, and to provide the coating film.

This conductive polymer coating composition of the present invention comprises an aqueous conductive polymer dispersion, a water-soluble binder resin, an alcohol solvent, an organic solvent, water, a water-soluble olefin wax, and a fluororesin. The method for producing the conductive polymer coating composition of the present invention comprises a process for coating a substrate with a conductive polymer composition and a process for drying the coated composition.


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Inventors:
SON JUNG HYUN
PARK JONG DAI
SHU KANFUKU
Application Number:
JP2007217833A
Publication Date:
March 06, 2008
Filing Date:
August 24, 2007
Export Citation:
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Assignee:
DONGJIN SEMICHEM CO LTD
International Classes:
C09D201/00; B05D5/12; B05D7/04; C09D5/00; C09D5/24; C09D7/12; C09D127/12; C09D165/00; C09D179/02; C09D191/06; H01B1/12; H01B1/20
Domestic Patent References:
JP2006178424A2006-07-06
JP2006175848A2006-07-06
JP2006142769A2006-06-08
JP2003320631A2003-11-11
JP2000026817A2000-01-25
Attorney, Agent or Firm:
Tomihiko Isono



 
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