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Title:
導電性ポリマー組成物
Document Type and Number:
Japanese Patent JP3692141
Kind Code:
B2
Abstract:
A conductive polymer composition containing a particulate conductive filler dispersed in a polymeric component. The polymeric component comprises a first polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) is polyethylene, and a second polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) comprises units derived from a first monomer which is ethylene and a second monomer which is an alkyl acrylate having the formula -CH2=CHCOOCmH2m+1-, where m is at least 4. The resulting composition is useful in preparing electrical devices, e.g. circuit protection devices, which have lower resistivities, higher PTC anomalies, and better thermal and electrical stability than devices comprising conventional conductive polymer compositions.

Inventors:
Chu, Edward F
Thane, Nelson H
Lady, Vijay
Chandler, Daniel A
Application Number:
JP50135296A
Publication Date:
September 07, 2005
Filing Date:
June 07, 1995
Export Citation:
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Assignee:
RAYCHEM CORPORATION
International Classes:
C08K3/00; C08K3/04; C08L23/04; C08L23/06; C08L23/08; H01B1/12; H01B1/20; H01B1/22; H01B1/24; H01C7/02; H01M4/66; H01M10/30; H01M10/42; H01M10/48; H01M2/34; H01M6/50; (IPC1-7): C08L23/06; C08K3/04; C08L23/08; H01M10/30
Domestic Patent References:
JP3255143A
JP59006242A
JP64051452A
Attorney, Agent or Firm:
Aoyama Aoi
Yasuo Shibata