Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONDUCTIVE POWDER, ITS MANUFACTURING METHOD AND ITS APPLICATION
Document Type and Number:
Japanese Patent JP2002270032
Kind Code:
A
Abstract:

To provide conductive powder capable of moderating a percolation phenomenon particular to carbon black in adding rubber, resin or the like and provide a conductive composition filled with it and its manufacturing method.

This conductive powder is characterized in that it contains carbon powder and SiOx (0.5<x<1.5) and the percentage content of the SiOx is 1-50 mass%. This manufacturing method therefor, this conductive composition of rubber and/or resin filled with the conductive powder, a conductive conditioning material of carbon powder comprising powder of SiOx (0.5<x<1.5) are provided as well.


Inventors:
HAMAZAKI SHINICHI
WATANABE SHOJIRO
Application Number:
JP2001063233A
Publication Date:
September 20, 2002
Filing Date:
March 07, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
C08K3/04; C08K3/36; C08L21/00; C08L101/00; C09C1/56; C09C3/06; H01B1/04; H01B1/24; H01B13/00; (IPC1-7): H01B1/04; C08K3/04; C08K3/36; C08L21/00; C08L101/00; C09C1/56; C09C3/06; H01B1/24; H01B13/00
Domestic Patent References:
JP3072008B
JPH05213606A1993-08-24