Title:
Conductive resin composition
Document Type and Number:
Japanese Patent JP6155876
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive resin composition with good solution stability which, for example, when used by being processed into a conductive sheet, has good heat resistance and is capable of suppressing deterioration in conductivity and adhesiveness for a long period of time.SOLUTION: The conductive resin composition contains: a thermosetting resin having an acid value of 5-90 mgKOH/g; conductive fine particles each formed by coating a conductive metal core with a conductive material different from the metal core; and a compound having a bond unit of a specific structure. Preferably, the compound having a unit represented by chemical formula (1) is contained in an amount of 0.5-10 pts.wt. based on 100 pts.wt. of the conductive fine particles.
Inventors:
Tsutomu Hayasaka
Shota Mori
Nishiyama Yuji
Takahashi Masakatsu
Shota Mori
Nishiyama Yuji
Takahashi Masakatsu
Application Number:
JP2013125640A
Publication Date:
July 05, 2017
Filing Date:
June 14, 2013
Export Citation:
Assignee:
Toyo Ink sc Holdings Co., Ltd.
Toyochem Co., Ltd.
Toyochem Co., Ltd.
International Classes:
C08L101/00; B32B7/02; B32B27/00; C08J5/18; C08K3/08; C08K5/24; C08K9/02; C08K9/04; H01B1/00; H01B1/22; H01B5/02; H01B5/14
Domestic Patent References:
| JP63178181A | ||||
| JP63245484A | ||||
| JP2012211256A | ||||
| JP2003055583A | ||||
| JP4158081A |