導電性樹脂硬化物及び電子部品モジュール

Title:

導電性樹脂硬化物及び電子部品モジュール

Document Type and Number:

Japanese Patent JP4748158

Kind Code:

B2

Abstract:

This invention provides a conductor powder, which can improve electrical connection reliability by increasing a shot key current value, an electrically conductive resin composition, and a cured product of an electrically conductive resin. In a conductor powder comprising at least one element selected from silver, gold, nickel, and tin, at least a part of the surface of the conductor powder does not contain an oxygen atom in its molecular skeleton and has been surface treated with an amine compound containing one nitrogen atom. Further, the surface treating agent is preferably an aliphatic amine compound, more preferably an aliphatic primary amine compound.

Inventors:

Takashi Osawa
Akihiko Kawakami

Application Number:

JP2007521099A

Publication Date:

August 17, 2011

Filing Date:

February 17, 2006

Export Citation:

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