CONDUCTIVE OR SEMI-CONDUCTIVE RESIN MOLDING AND MANUFACTURE THEREOF

Japanese Patent JP3465727

B2

PURPOSE: To provide a conductive or semi-conductive resin molding and to reduce surface energy by providing a film of resin containing a fluororesin or silicone on the surface of the molded body comprising polymer blend of polyaniline in the non-doped state or doped state and other macromolecular material, and setting the pure-water contact angle of the surface at a specified value or more.
CONSTITUTION: In this conductive or semi-conductive resin molding, polyaniline in the non-doped state or doped state and another polyaniline material are dissolved in an organic solvent and the solvent is removed from the obtained solution. Thus, a polymer blend comprising the polyaniline in the non-doped state and the polymer is adjusted. Then, the polymer blend is molded, and a molding is obtained. In this molding comprising a polymer blend such as this, the ratio of the polyaniline in the molding comprising the polymer blend is set in the range of 0.1-99wt.%. The molding can be obtained by forming the film of the fluororesin or silicone on the surface of the obtained molding. Furthermore, the pure-water contact angle of the surface is set at 90° or more.

Yoshihiro Uetani
Zenichi Ueda

JP15621695A

November 10, 2003

June 22, 1995

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NITTO DENKO CORPORATION

B32B7/02; B32B27/28; B32B27/30; B32B27/34; C08J7/04; C08J9/28; C08J7/06; C08L79/00; C08L79/08; (IPC1-7): B32B27/28; B32B27/30; B32B27/34; C08L79/00; C08L79/08

JP594096A
JP463865A
JP6228335A
JP6240145A
JP5247203A
JP5247204A
JP352929A

Itsuro Makino

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