導電性条材

Japanese Patent JP7060514

B2

[Problem] To provide a conductive bar material which maintains low contact resistance in a high temperature environment and exhibits excellent heat resistance, while having excellently low insertion resistance. [Solution] A conductive bar material which sequentially comprises a layer composed of Ni or an Ni alloy, a layer mainly composed of Cu, and an alloy layer composed of Cu and Sn in this order on a conductive substrate composed of Cu or a Cu alloy, and which is configured such that: the thickness of the layer composed of Ni or an Ni alloy is 0.1-2.0 μm; the thickness of the layer mainly composed of Cu is 0.01-0.1 μm; the thickness of the alloy layer composed of Cu and Sn is 0.1-2.0 μm; the surface roughness Ra is 0.05-1.0 μm; an oxide of Cu and an oxide of Sn are contained in an oxide film that is formed on the surface; the thickness of the oxide film is 50 nm or less; the proportion (%) of the oxide of Sn is 90% or more; and the contact resistance of this bar material after being heated at the temperature of 140°C for 120 hours in the atmosphere is 10 mΩ or less under a load of 1N via an Ag probe.

JPS61134204	FORM WORK FOR MOLDING GRC DECORATIVE BOARD
JP2006088451	PT BASE CONDUCTIVE COATING MATERIAL EXCELLENT IN SECULAR DETERIORATION CHARACTERISTIC RESISTANCE

Shuichi Kitagawa
Akiyori Tachibana
Yoshikazu Okuno
Megumi Fujii
Tatsuya Nakatsugawa
Shingo Kawada

JP2018546247A

April 26, 2022

October 06, 2017

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THE FURUKAW ELECTRIC CO.,LTD.

B32B15/01; C25D7/00; C25D5/12; C25D5/50; H01R13/03

JP2005350774A
JP2007247060A
JP2009135097A
JP2007270266A
JP2010090400A

Patent corporation Iida and Partners
Toshizo Iida
Shuichi Akabane

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