Title:
導電性基板、電子装置及び表示装置
Document Type and Number:
Japanese Patent JP7172211
Kind Code:
B2
Abstract:
An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.
Inventors:
Great Virtue Takashi
Susumu Taniguchi
Eiko Seki
Atsushi Sato
Yuhei Horikawa
Makoto Orikasa
Toshiyuki Abe
Susumu Taniguchi
Eiko Seki
Atsushi Sato
Yuhei Horikawa
Makoto Orikasa
Toshiyuki Abe
Application Number:
JP2018133395A
Publication Date:
November 16, 2022
Filing Date:
July 13, 2018
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01L23/12; G06F3/041; G09F9/30; H01L21/3205; H01L21/60; H01L21/768; H01L23/14; H01L23/522; H05K3/18
Domestic Patent References:
| JP2015148966A | ||||
| JP2009191143A | ||||
| JP2012079238A | ||||
| JP2016177557A | ||||
| JP2016122820A | ||||
| JP2010238702A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Mikami Takashi
Yoshiki Kuroki
Mikami Takashi
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