To provide a conductive transfer film having the same facility as a conventional adhesive type conductive transfer film, excellent in productivity and dissolving a fault of laminating mold releasable films on both sides of a conductive layer in order to prevent blocking, required for the conventional adhesive type conductive transfer film.

A conductive transfer film used by transfer-releasing only a conductive layer from a support body is formed by laminating the conductive layer, formed of a micro-capsule with liquid epoxy resin envelopped therein, noncohesive matrix resin and a conductive agent, on a support body film with the surface subjected to mold release treatment. The partition wall of the envelopping micro-capsule is ruptured by heat, pressure and shearing force to optionally manifest tackiness.