To obtain a conductor connecting device capable of uniformizing temperature in each segment and reducing deviation in a temperature distribution.
The conductor connecting device has a pair of thermally-conductive guide plates 4a, 4b arranged in parallel with each other and perpendicular to the shaft direction between conductors 1, 2, a plurality of segments 3 which are fitted into the circumferential edge of each guide plate 4a, 4b so as to straddle over the pair of guide plates 4a, 4b, and straddle between the conductors 1, 2 to contact with outer circumference of both conductors, an elastic body 5 which presses the pair of guide plates 4a, 4b against each segment 3 to exert a contact force, and a spring 6 which presses each segment 3 against the conductors 1, 2 from the outside to exert the contact force.
YAMASHITA TORU
TAKEUCHI TOSHIE
MATSUDA DAIJI
YOSHIDA DAISUKE
