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Title:
CONDUCTOR FOIL WITH ANISOTROPY CONDUCTIVE LAYER AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH10163596
Kind Code:
A
Abstract:

To bond a lead with superior laminating accuracy with small deformation, without the necessity of laminating an anisotropic conductive tape by directly laminating an adhesive layer containing conductive particles on an overall conductor foil roughed surface.

A roughened surface of an electrolytic copper foil 1 is coated with an adhesive solution obtained by diffusing conductive particles attained by gold-plating polystyrene particles in the solution and drying it to form a copper foil with anisotropic conductive layer 2, and slitted in a predetermined width to a composite tape. This tape is punched to form sprocket holes 5 and a device hole 6 at a polyimide film 3 with epoxy adhesive 4, laminated, and then after-cured. Further, inner lead and outer lead pitches are processed at 7 as prescribed in normal step of three layer TAB for obtaining a TAB tape having a thin adhesive layer in the hole 6. Accordingly, since it has no positional deviation, its has easy alignment.


Inventors:
Yamamori, Yoshiyuki
Application Number:
JP1996000324296
Publication Date:
June 19, 1998
Filing Date:
December 04, 1996
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO LTD
International Classes:
H01L21/60; H01B1/20; H01R11/01; H01R43/00; H05K1/14; H05K3/32; H05K3/36; H05K3/40; (IPC1-7): H05K1/14; H01B1/20