Title:
CONDUCTOR FORMING COMPOSITION, METHOD FOR PRODUCING CONDUCTOR, CONDUCTOR AND DEVICE
Document Type and Number:
Japanese Patent JP2017122260
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductor forming composition which can form a conductor having excellent adhesiveness at a low temperature, a method for producing a conductor using the same, a conductor which can be formed at a low temperature and has excellent adhesiveness, and a device having the conductor.SOLUTION: A conductor forming composition has a copper-containing particle, a dispersion medium, and an organic compound that is not dissolved in the dispersion medium. The copper-containing particle has a core particle having copper, and organic matter present on at least part of the surface of the core particle. The percentage of a copper-containing particle with the major axis of 50 nm or less in length is 55% or less in number.SELECTED DRAWING: Figure 1
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Inventors:
YONEKURA GENKI
URASHIMA KOSUKE
KAMISHIRO YASUSHI
URASHIMA KOSUKE
KAMISHIRO YASUSHI
Application Number:
JP2016001257A
Publication Date:
July 13, 2017
Filing Date:
January 06, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B22F1/00; B22F1/02; H01B1/00; H01B1/22; H01B13/00
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office