Title:
CONDUCTOR PASTE, AND HEAT DISSIPATION SUBSTRATE USING THE SAME
Document Type and Number:
Japanese Patent JP2015149162
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductor paste for low temperature firing capable of forming a conductor film of which a resin is sufficiently fired even by firing at low temperatures of 500°C or lower, and conductivity and adhesiveness are excellent.SOLUTION: Such a conductor paste (copper paste) contains copper powder, a glass frit, a thermoplastic resin, and a solvent. The thermoplastic resin has such properties as to be fired in an inert gas atmosphere at temperatures of 500°C or lower, and is contained at a ratio of 0.1-1 mass% when the whole conductor paste is set at 100 mass%. The solvent contains a high-viscosity organic solvent having viscosity at 20°C of 200-2,000 mPa s.
Inventors:
OKUDA KAZUHIRO
Application Number:
JP2014020673A
Publication Date:
August 20, 2015
Filing Date:
February 05, 2014
Export Citation:
Assignee:
NORITAKE CO LTD
International Classes:
H01B1/22; B32B18/00; C09D5/24; C09D7/12; C09D123/10; C09D125/04; C09D129/14; C09D133/00; C09D201/00; H01B5/14
Domestic Patent References:
| JP2012109148A | 2012-06-07 | |||
| JP2011070798A | 2011-04-07 | |||
| JP2013258128A | 2013-12-26 | |||
| JP2015086090A | 2015-05-07 |
Attorney, Agent or Firm:
Makoto Abe
Michiko Oi
Michiko Oi
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