Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
導電体ペースト、電子部品およびそれらの製造方法
Document Type and Number:
Japanese Patent JP4088594
Kind Code:
B2
More Like This:
JPH07207185COATED PALLADIUM FINE POWDER AND CONDUCTIVE PASTE
WO/2014/003066WHITE CONDUCTIVE POWDER, DISPERSION LIQUID THEREOF, COATING MATERIAL, AND FILM COMPOSITION
Inventors:
Tatsuya Kojima
Application Number:
JP2004024221A
Publication Date:
May 21, 2008
Filing Date:
January 30, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
tdk Corporation
International Classes:
H01B1/00; H01G4/12; H01B1/22; H01B13/00
Domestic Patent References:
JP2001068374A
JP2001247901A
JP2003129107A
Attorney, Agent or Firm:
Hitoshi Maeda
Shingo Nishide
Koichiro Okura
Miki Sato



 
Previous Patent: 補助ランプ収納装置

Next Patent: 半導体装置及びその製造方法