Title:
結晶質マルチトールの硬質コーティング層を有する菓子又は薬剤及びその製造方法
Document Type and Number:
Japanese Patent JP4585630
Kind Code:
B2
More Like This:
WO/2013/147279 | NON-TEMPERED CHOCOLATE |
JPH04370062 | SNACK FOOD AND PRODUCTION THEREOF |
JP2008131959 | STRUCTURE FOR FOOD PRODUCT WITH WAFER SHELL AND CREAMY FILLING |
Inventors:
Megumi Satomi
Togawa Shiho
Togawa Shiho
Application Number:
JP2004065973A
Publication Date:
November 24, 2010
Filing Date:
March 09, 2004
Export Citation:
Assignee:
Mitsubishi Corporation Food Tech Co., Ltd.
International Classes:
A23G1/30; A61K47/36; A23G1/00; A23G3/00; A23G3/34; A23G3/50; A23G4/00; A61K9/36; A61K47/10; A61K47/26
Domestic Patent References:
JP6189708A | ||||
JP200217266A | ||||
JP7258466A |
Attorney, Agent or Firm:
Keiichi Ota
Haruhiko Keida
Haruhiko Keida