Title:
接合体、接合体の製造方法、および、接合体の有機残留物評価方法
Document Type and Number:
Japanese Patent JP7392698
Kind Code:
B2
Abstract:
A bonded body (10) obtained by bonding a first member (11) to a second member (12) with a solder layer (13) therebetween, wherein when the bonded body (10) is immersed in isopropanol to extract organic residues contained in the bonded body (10), the UV absorption spectrum of an extract having the extracted organic residues is measured, and the obtained UV absorption spectrum is standardized such that the absorbance at a wavelength of 207 nm is set as 100, the absorbance at a wavelength of 300 nm as obtained from the standardized UV absorption spectrum is at most 4.
Inventors:
Fei Shu Jie
Tsukasa Yasojima
Kazuo Hirose
Tsukasa Yasojima
Kazuo Hirose
Application Number:
JP2021146645A
Publication Date:
December 06, 2023
Filing Date:
September 09, 2021
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H01L21/52; G01N21/33
Foreign References:
| WO2019022193A1 | ||||
| WO2020153418A1 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Onami Kazunori
Mitsuo Teramoto
Fumihiro Hosokawa
Onami Kazunori
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