PURPOSE: To connect circuit components to a circuit board having bumps at low temperature easily and with high reliability, by excluding an adhesive resin layer from a region to be connected by compression bonding.
CONSTITUTION: First of all, a semiconductor device 111 having a circuit board 101 and a plurality of connections 112 and covered with a passivation film 113 except at the connections 2 is prepared. And the connections 112 of the semiconductor device 111 and the bumps 107 of the circuit board 101 are positioned, after adhesive denatured epoxy resin 181 is applied on a surface having the connections 112 of the semiconductor device 111. Next, the semiconductor device 111 is pressed, and the connections of the semiconductor 111 and the bumps 107 of the circuit board 101 are connected electrically. By this pressing, superfluous epoxy resin 101 is forced out. After that, the resin 181 is heat-treated to make the adhesion firm. Consequently, low temperature joining becomes feasible, and it becomes possible to obtain high-reliability connection.
MIYAZAKI TOYOHIDE
KONDO HIROSHI
SAKAKI TAKASHI
TERAYAMA YOSHIMI
