Title:
CONNECTING METHOD FOR PRINTED CIRCUIT BOARD CONDUCTOR AND METALLIC PART
Document Type and Number:
Japanese Patent JPH06325802
Kind Code:
A
Abstract:
PURPOSE: To weld a metallic part, such as a lead or the like forming an electronic part, to a conductor on a printed circuit board in low proportion defective.
CONSTITUTION: At least one of the interconnected faces of a conductor on a printed circuit board and a metallic part is plated with nickel or gold, so that the amount of an oxide film causing incomplete welding formed on the face may be reduced or completely reduced to zero for welding the part to the conductor. This can reduce proportion defective on the welding.
Inventors:
FUJII ATSUHIKO
TAKANO SATORU
TAKANO SATORU
Application Number:
JP11135393A
Publication Date:
November 25, 1994
Filing Date:
May 13, 1993
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01R4/02; H05K3/24; H05K3/32; (IPC1-7): H01R4/02
Attorney, Agent or Firm:
Bunji Kamata (2 outside)