Title:
WAFER TRANSFERRING APPARATUS
Document Type and Number:
Japanese Patent JP3241470
Kind Code:
B2
Abstract:
PURPOSE: To provide a wafer transferring apparatus in which a containing space of the apparatus may be small and which has a simple structure and a light weight in the case of transferring a wafer in a semiconductor manufacturing apparatus.
CONSTITUTION: A horizontal mechanism 38 is rotatably provided at a vertically movable elevation arm. The mechanism 38 has two independently telescopic sliders, and chucking heads 39, 40 are respectively provided at the two sliders. The heads 39, 40 respectively have wafer chucks 41 which can receive wafers. In the case of simultaneously transferring the wafers, integral telescoping of the two slides, vertical movements of the arm and rotation of the mechanism 38 are cooperated. In the case of partially moving the wafers, telescoping of one slider, vertical movements of the arm and the rotation of the mechanism 38 are cooperated.
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Inventors:
Hideki Koike
Toshikazu Kano
Eiji Hosaka
Toshikazu Kano
Eiji Hosaka
Application Number:
JP35259792A
Publication Date:
December 25, 2001
Filing Date:
December 10, 1992
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
B65G49/07; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B65G49/07
Domestic Patent References:
| JP4343415A |
Attorney, Agent or Firm:
Shoji Miyoshi