Title:
CONNECTION DEVICE, AND MANUFACTURE THEREOF, INSPECTION DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3553791
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a connection device, a manufacturing method and an inspection method thereof, wherein the connection device is capable of being surely connected to electrodes arranged on an inspection target object without imposing heavy loads on them and possessed of a probe that is lessened in length, so as to receive or transmit high-speed signals of high frequencies (several hundreds of MHz or higher).
SOLUTION: A connection device is equipped with a contact pressure applying means which is formed though a manner, where a conductor thin film is formed on the one surface of an insulating sheet 22 such as a polyimide film or the like, contact electrodes 21 where protrudent contact terminals 20 each coated with a hard metal film are implanted are formed resting on the basis of the conductor thin film, a leading wiring 23 electrically connected to the contact electrodes 21 is pressed between a wiring sheet formed, on the basis of a conductor film provided to the one surface or other surface of the insulating film of polyimide and the inspection target object to bring the tips of the protrudent contact terminals 20 implanted in the contact electrodes 21 into contact with the electrodes of the inspection target object to make an electrical contact between the leasing wiring and the inspection target object.
Inventors:
Kasukabe Susumu
Akio Hasebe
Akio Hasebe
Application Number:
JP9128998A
Publication Date:
August 11, 2004
Filing Date:
April 03, 1998
Export Citation:
Assignee:
Renesas Technology Corp.
International Classes:
G01R1/067; G01R1/073; G01R31/28; G01R31/26; H01L21/66; H05K3/40; G01R3/00; (IPC1-7): H01L21/66; G01R1/073; G01R31/26; G01R31/28
Domestic Patent References:
| JP7283280A | ||||
| JP63152243U |
Attorney, Agent or Firm:
Yamato Tsutsui
Yasuo Sakuta
Katsuo Ogawa
Yasuo Sakuta
Katsuo Ogawa