Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
構造物や物体からなるモジュール構造用連結装置
Document Type and Number:
Japanese Patent JP7352003
Kind Code:
B2
Abstract:
A coupling device for the modular construction of structures or objects includes a main body having at least one through-opening or at least one recess and being adapted to be coupled to at least one component of a structure or object. The at least one through-opening or the at least one recess is designed to interact with a coupling means for coupling the at least one component to the main body. The main body is formed as a corner element or edge element of a module of the structure or object.

Inventors:
pacarada, erville
Application Number:
JP2022501168A
Publication Date:
September 27, 2023
Filing Date:
June 22, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Pacarada, Ernesto
pacarada, erville
International Classes:
E04B1/58; E04B1/24; E04B1/348; F16B7/20
Domestic Patent References:
JP3046264U
JP2016183495A
JP10018440A
JP4193431A
Foreign References:
KR1020130103029A
US20150377414
DE2832087A1
US20120301215
Attorney, Agent or Firm:
Patent Attorney Corporation Towa International Patent Office