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Patent Searching and Data


Title:
CONNECTION DEVICE AND SUPERCONDUCTING MAGNET
Document Type and Number:
Japanese Patent JP11086923
Kind Code:
A
Abstract:

To reduce the thermal conductivity of a connection device connecting nonsuperconductor wiring to superconductor wiring, and increase the current capacity.

A substrate 11, an oxide superconductor layer 12 which is installed on both sides of the substrate 11 and composed of, for example, Y1Ba2 Cu3O7-X, etc., and a first connecting terminal 13a and a second connecting terminal 13b arranged on a first region 12a and a second region 12b of the oxide superconductor layer 12 respectively, are provided. A superconductor layer 12 may be installed on both sides of the substrate 11. Using the constitution can reduce the heat invasion by the substrate 11 and increase the current capacity.


Inventors:
Yamazaki, Mutsuki
Yoshino, Hisashi
Kubota, Hiroshi
Kudo, Yuki
Application Number:
JP1997000248846
Publication Date:
March 30, 1999
Filing Date:
September 12, 1997
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01R4/68; H01F6/00; H01R4/58; H01F6/00; (IPC1-7): H01R4/68; H01F6/00