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Title:
CONNECTION MATERIAL
Document Type and Number:
Japanese Patent JP2017171919
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a connection material for circuit members which has small residual stress and excellent connection reliability.SOLUTION: The connection material, which connects a first circuit member having a first main surface provided with a transparent electrode containing an oxide containing indium and tin with a second circuit member having a second main surface provided with a metal electrode, contains an adhesive and a solder material dispersed in the adhesive. The solder material contains a bismuth-indium alloy, the amount of indium contained in the bismuth-indium alloy is 32-73 mass%, the melting point of the bismuth-indium alloy is 72-109°C, and the total amount of bismuth and indium contained in the solder material is 95 mass% or more.SELECTED DRAWING: Figure 9

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Inventors:
KISHI ARATA
MAEDA KEN
SAKAI TADAHIKO
Application Number:
JP2017064131A
Publication Date:
September 28, 2017
Filing Date:
March 29, 2017
Export Citation:
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Assignee:
PANASONIC IP MAN CORP
International Classes:
C09J201/00; C09J9/02; C09J11/04; C22C12/00; C22C28/00; H05K1/14; H05K3/34
Domestic Patent References:
JPS60170176A1985-09-03
JP2010226140A2010-10-07
JP2013076045A2013-04-25
JP2006294600A2006-10-26
JP2001198692A2001-07-24
JP4831069B22011-12-07
JP2010073394A2010-04-02
JP2012532942A2012-12-20
Attorney, Agent or Firm:
Shinichi Kawasaki
Yuko Tsumura



 
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