Title:
CONNECTION MATERIAL
Document Type and Number:
Japanese Patent JP3633422
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a connecting material which is superior in adhesive property, electrical connection, and insulation property, wherein there is no short- circuiting between electrodes next to each other even when a high voltage or high current is applied, and which can be used to connect a connected member that electrode opposingly facing each other for the high voltage or high current.
SOLUTION: This connecting material is provided for connecting members to be connected with electrodes facing each other, and this is also the one which includes a resin component mainly consisting of a thermosetting resin, and also includes a metal ion scavenger of 1 to 60 wt% to the resin component, capturing metal ions which dissociate from an electrode and an electro- conductive material, and the metal ion scavenger is the connection material which has smaller sized particles than electro-conductive particles.
Inventors:
Mikio Sakairi
Application Number:
JP2000050486A
Publication Date:
March 30, 2005
Filing Date:
February 22, 2000
Export Citation:
Assignee:
Sony Chemical Co., Ltd.
International Classes:
H01L21/20; H01R11/01; H01L21/60; H05K3/30; H05K3/32; (IPC1-7): H01R11/01
Domestic Patent References:
| JP10245528A | ||||
| JP9199207A | ||||
| JP56062858A | ||||
| JP5121465A | ||||
| JP63045702A | ||||
| JP9018040A |
Attorney, Agent or Firm:
Shigeru Yanagihara