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Title:
CONNECTION METHOD OF FPC
Document Type and Number:
Japanese Patent JP2003157949
Kind Code:
A
Abstract:

To provide a connection method of FPC with improved workability and reliability capable of preventing breakage of a conducting part and lowering of insulation property, and capable of confirming the completed state of connection from outside.

At a first process, an FPC 11 and an FPC 15 are vertically laid one upon the other so as to make the upper surface of a conduction part 13 of the FPC 11 contact with the lower surface of a conduction part 17 of the FPC 15. At a second process, melted metal drops 19 are sprayed or dropped against a difference in level 22 formed between the surface of the conduction part 13 of the FPC 11 and the surface of the conduction part 17 of the FPC 15. The sprayed or dropped melted metal drops 19 are adhered to the surface of the conduction part 13 of the FPC 11 and the surface of the conduction part 17 of the FPC 15, and the FPC 11 and the FPC 15 are electrically connected with each other by the adhered metal drops 19.


Inventors:
OHASHI HITOSHI
USHIJIMA HITOSHI
Application Number:
JP2001359040A
Publication Date:
May 30, 2003
Filing Date:
November 26, 2001
Export Citation:
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Assignee:
YAZAKI CORP
International Classes:
B23K3/06; B23K28/00; H01R43/00; H01R43/02; H05K3/36; H05K3/34; (IPC1-7): H01R43/02; H01R12/08; H01R43/00
Attorney, Agent or Firm:
Yasushi Kobayashi (1 person outside)