Title:
CONNECTION METHOD FOR WAVEGUIDE AND OPTICAL FIBER ON SUBSTRATE AND WAVEGUIDE SUBSTRATE WITH OPTICAL FIBER
Document Type and Number:
Japanese Patent JP2555256
Kind Code:
B2
Abstract:
PURPOSE: To provide a connection method for efficiently and highly reliably abutting and joining a waveguide and an optical fiber on a substrate without adversely affecting light signals passing through there and the substrate manufactured by the method.
CONSTITUTION: Notches 38 and 39 are formed at the part of the substrate 28 on both sides of the end part of the waveguide 34 first. Then, the end part of the optical fiber 40 is matched so as to be abutted to the end part of the waveguide 34 positioned between the notches 38 and 39. Then, the end part of the optical fiber and the end part of the waveguide 34 arranged in abutted relation are encapsulated by an adhesive material. Then, the end parts are held with each other until the adhesive material is hardened.
Inventors:
KORADO DORAGON
HAAMAN PURESUBII
HAAMAN PURESUBII
Application Number:
JP6917393A
Publication Date:
November 20, 1996
Filing Date:
March 05, 1993
Export Citation:
Assignee:
EI TEI ANDO TEI CORP
International Classes:
G02B6/30; (IPC1-7): G02B6/30
Domestic Patent References:
| JP5224077A | ||||
| JP59189308A | ||||
| JP6391608A |
Attorney, Agent or Firm:
Hirofumi Mimata