Title:
CONNECTION STRUCTURE AND BANKING STRUCTURE
Document Type and Number:
Japanese Patent JP2023155091
Kind Code:
A
Abstract:
To form a banking structure while preventing leakage of a banking material irrespective of the arranging state of a member or the type of the banking material.SOLUTION: This connection structure is used for connecting a tie rod to a wall body and a ground wall surface in a banking structure, which comprises: the wall body, provided at a position opposed to the ground wall surface formed by the ground; the tie rod, which connects the wall body and the ground wall surface; and a banking material that fills the gap between the ground wall surface and the wall body. In the connection structure, a connection angle between the wall body and the tie rod is changeable and/or a connection angle between the ground wall surface and the tie rod is changeable.SELECTED DRAWING: Figure 1
Inventors:
ENDO DAISUKE
Application Number:
JP2022064853A
Publication Date:
October 20, 2023
Filing Date:
April 09, 2022
Export Citation:
Assignee:
INOAC HOUSING & CONSTRUCTION MAT CO LTD
International Classes:
E02D17/18; E02D17/20
Attorney, Agent or Firm:
KT&S Patent Attorney Corporation