CONNECTION STRUCTURE BETWEEN DIELECTRIC WAVEGUIDE LINE AND HIGH FREQUENCY LINE CONDUCTOR

Japanese Patent JP3517143

B2

PROBLEM TO BE SOLVED: To provide a connection structure between a dielectric waveguide line and a high frequency line conductor that can connect the laminated dielectric waveguide line with the high frequency line conductor such as a microstrip line, a strip line or a high frequency line with an excellent characteristic even when a characteristic impedance of the dielectric waveguide line differs from that of the high frequency line conductor.
SOLUTION: The connection structure is used to connect a high frequency line conductor 20 with a dielectric waveguide line 16 by inserting an end of the high frequency line conductor 20 to an opening end of the dielectric waveguide line 16 consisting of a couple of main conductor layers 12, 13 having a dielectric board 11 inbetween and two rows of through-conductor groups 14 for sidewall that are formed between the main conductor layers 12, 13 at a prescribed interval with a prescribed width and of a sub conductor layer 15 and by electrically connecting the end of the high frequency line conductor 20 and one (12) of the main conductor layers 12, 13 with a connection use line conductor 18 and a connection use through-conductor 17 in a way of forming a step. Even when the characteristic impedance of the conductor 20 differs from that of the line 16, the connection structure connects the both with an excellent characteristic and since the thickness of the connection structure is thin, the connection structure can be miniaturized.

Kiyohara, Toshifumi
Uchimura, Hiroshi

JP1300499A

April 05, 2004

January 21, 1999

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KYOCERA CORP

H05K1/02; H01P3/12; H01P5/107; (IPC1-7): H01P5/107; H05K1/02

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